DALLAS, July 16, 2024 /PRNewswire/ -- Texas Instruments (TXN) today introduced six new power modules designed to improve power density, enhance efficiency and reduce EMI. These power modules leverage ...

Dublin, March 11, 2026 (GLOBE NEWSWIRE)-- The "Critical Materials for Power Module Packaging: Market Outlook, Supply Chain Risk & Technology Trends 2026-2036" report has been added to ...

These ultra-tiny power modules developed by Texas Instruments, which are 23% smaller than competing devices, also improve power density and efficiency. 1. New power modules built with MagPack ...

Texas Instruments (TI) unveiled at the Applied Power Electronics Conference (APEC) 2026 isolated power modules that allow for increased power density, efficiency and safety in data centers, electric ...

Founded in 1987, Boschman Technologies B.V. is a manufacturer of sintering equipment and transfer molding technology for advanced packaging of automotive and industrial power modules, MEMS sensors. In ...

Texas Instruments revealed a family of isolated power modules based on its IsoShield multichip packaging technology, claiming 3X higher power density than discrete solutions in isolated power designs.

The power semiconductor market is poised for remarkable growth in the next several years, fueled by the adoption of electric vehicles and renewable energy, but it also driving big changes in the ...

Power device manufacturers exhibit their latest advances in topologies, packaging, and solutions at APEC 2026.