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Over the last year, memory has become a critical bottleneck within AI data centers. Traditional DRAM struggles to keep pace with the latency and bandwidth needs of next-generation AI accelerators.

JEDEC’s HBM4 and the emerging SPHBM4 standard boost bandwidth and expand packaging options, helping AI and HPC systems push past the memory and I/O walls. Why AI and HPC compute scaling is outpacing ...

With a 23% holdings overlap as of April 2026, WTAI and WQTM offer complementary exposure to the shared pursuit of greater ...

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The AI boom is now so powerful and widespread in nature that it is overwhelming all other drivers of returns and shaping a ...

Many of the stocks listed on China’s STAR Market have delivered solid total returns to investors this year. This has been reflected in the YTD performance of the China technology ETF, the KraneShares ...

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The European Commission (EC) has unveiled a European Technological Sovereignty Package designed to secure the continent’s future capacity in cloud, artificial intelligence (AI), open source and ...

Nvidia's announced entry into the PC chip market sent shares of AMD, Intel and Qualcomm lower on Monday as Wall Street recognized the threat. Jensen Huang, Nvidia's CEO, signaled his intent to ...