A technical issue with the mailing label process for permanent vote-by-mail ballots caused some headaches this week in the Lee County Election Department. The office over the past few days has been ...

The “reverse hybrid” assembly process involves using SAC (Sn-Ag-Cu) solder paste in conjunction with BGA components that feature low-temperature solder (LTS) balls. The soldering is performed using a ...

A factorial design investigating solder paste volume under varied squeegee pressure and squeegee types. It is generally agreed that, on average, 40% to 60% of the defects generated by a surface mount ...

Abstract: Current technology drivers span a broad spectrum that include miniaturized hand-held devices where real estate is at a minimum as well as high density server assemblies that have ...

CmController5 Compact reportedly helps improve yields and reduce solder joint defects by improving solder paste printing machine process stability. Solder paste printing is a critical step in the SMT ...